پلی آمید 66- ساده
KOPLA PA66 |
SORT |
UNFILLED GRADES |
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NEW |
KDP1000 |
KDP1100 |
KDP1000R |
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OLD |
U166E |
U166ER |
U166HS |
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Properties |
Test Method (ASTM) |
Condition |
unit |
Injection Grade- General-Rapid cycling |
Heat Stabilized |
||
Specific Gravity |
D792 |
- |
- |
1.14 |
1.14 |
1.14 |
|
Water Absorption |
D570 |
23°C, Water, 24h |
% |
1.3 |
1.3 |
1.3 |
|
Poisson's Ratio |
D638 |
23°C |
- |
0.4 |
0.4 |
0.4 |
|
Molding Shrinkage(1/8') |
D955 |
Flow |
% |
1.7-2.2 |
1.7-2.2 |
1.5-2.0 |
|
Xflow |
% |
1.8-2.3 |
1.8-2.3 |
1.8-2.2 |
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Melting Point |
DSC Method |
- |
°C |
260 |
260 |
263 |
|
Heat Deflection Temperature |
D648 |
4.6kgf/cm² |
°C |
220 |
220 |
220 |
|
18.6kgf/cm² |
°C |
90 |
90 |
90 |
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Coefficient of Linear Thermal Expansion |
D696 |
- |
X10-5l/K |
7 |
7 |
7 |
|
Tensile Strength |
D638 |
23°C(RH0/RH50) |
Mpa |
85/60 |
85/60 |
83/60 |
|
Tensile Modulus |
D639 |
23°C(RH0/RH50) |
Mpa |
3200/1600 |
3200/1600 |
3200/1600 |
|
Tensile Elongation |
D638 |
23°C(RH0/RH50) |
% |
50/>80 |
50/>80 |
30/>50 |
|
Flexural Strength |
D790 |
23°C(RH0/RH50) |
Mpa |
120/60 |
120/60 |
120/60 |
|
Flexural Modulus |
D790 |
23°C(RH0/RH50) |
Mpa |
3000/1300 |
3000/1300 |
3000/1300 |
|
Izod Impact Strength |
D256 |
Notched(RH0/RH50) |
Mpa |
3/7 |
3/7 |
3/7 |
|
Rockwell Hardness |
D785 |
R-scale(RH0/RH50) |
kJ/M^2 |
120/105 |
120/105 |
120/105 |
|
Flammability |
UL94 |
32MM |
- |
V-2 |
V-2 |
V-2 |
|
Dielectric Constant |
D150 |
10^6Hz |
- |
2.9 |
2.9 |
2.9 |
|
Dielectric Dissipation Factor |
D150 |
10^6Hz |
- |
0.03 |
0.03 |
0.03 |
|
Volume Resistivity |
D257 |
- |
Ω·CM |
1*10^15 |
1*10^15 |
1*10^15 |
|
Dielectric Strength |
D149 |
- |
KV/mm m |
30 |
30 |
27 |