پلی آمید 66- ساده

KOPLA PA66

SORT

UNFILLED GRADES

 

NEW

KDP1000

KDP1100

KDP1000R

 

OLD

U166E

U166ER

U166HS

 

Properties

Test Method (ASTM)

Condition

unit

Injection Grade- General-Rapid cycling

Heat Stabilized

 
 
 

Specific Gravity

D792

-

-

1.14

1.14

1.14

 

Water Absorption

D570

23°C, Water, 24h

%

1.3

1.3

1.3

 

Poisson's Ratio

D638

23°C

-

0.4

0.4

0.4

 

Molding Shrinkage(1/8')

D955

Flow

%

1.7-2.2

1.7-2.2

1.5-2.0

 

Xflow

%

1.8-2.3

1.8-2.3

1.8-2.2

 

Melting Point

DSC Method

-

°C

260

260

263

 

Heat Deflection Temperature

D648

4.6kgf/cm²

°C

220

220

220

 

18.6kgf/cm²

°C

90

90

90

 

Coefficient of Linear Thermal Expansion

D696

-

X10-5l/K

7

7

7

 

Tensile Strength

D638

23°C(RH0/RH50)

Mpa

85/60

85/60

83/60

 

Tensile Modulus

D639

23°C(RH0/RH50)

Mpa

3200/1600

3200/1600

3200/1600

 

Tensile Elongation

D638

23°C(RH0/RH50)

%

50/>80

50/>80

30/>50

 

Flexural Strength

D790

23°C(RH0/RH50)

Mpa

120/60

120/60

120/60

 

Flexural Modulus

D790

23°C(RH0/RH50)

Mpa

3000/1300

3000/1300

3000/1300

 

Izod Impact Strength

D256

Notched(RH0/RH50)

Mpa

3/7

3/7

3/7

 

Rockwell Hardness

D785

R-scale(RH0/RH50)

kJ/M^2

120/105

120/105

120/105

 

Flammability

UL94

32MM

-

V-2

V-2

V-2

 

Dielectric Constant

D150

10^6Hz

-

2.9

2.9

2.9

 

Dielectric Dissipation Factor

D150

10^6Hz

-

0.03

0.03

0.03

 

Volume Resistivity

D257

-

Ω·CM

1*10^15

1*10^15

1*10^15

 

Dielectric Strength

D149

-

KV/mm m

30

30

27

 

همکاران تجاری

  • 1.jpg
  • 2.jpg
  • 6.jpg
  • 7.jpg
  • 8.jpg
  • 9.jpg

محصولات

  • product 15.jpg
  • product 2.jpg
  • product 12.jpg
  • product 10.jpg
  • product 3.jpg
  • product 4.jpg
  • product 5.jpg
  • product 6.jpg
  • product 1.jpg
  • product 8.jpg
  • product 14.JPG
  • product 16.jpg
  • product 18.jpg
  • product 9.jpg
  • product 11.jpg
  • product 17.jpg
  • product 7.jpg